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NCP5623B
PIN ASSIGNMENT
PIN
1
2
3
4
5
6
7
8
Name
C1P
GND
LED3
LED2
LED1
AGND
SDA
I REF
Type
POWER
POWER
INPUT,
POWER
INPUT,
POWER
INPUT,
POWER
ANALOG
GROUND
INPUT,
DIGITAL
INPUT,
ANALOG
Description
One side of the external charge pump capacitor (C FLY ) is connected to this pin, associated with C1N,
pin 12 (Note 1).
This pin is the GROUND signal for the analog and digital blocks and must be connected to the system
ground.
This pin sinks to ground and monitors the current flowing into the LED3, intended to be used in illu-
mination application (Note 2). The Anode of the associated LED shall be connected to the Vout pin.
This pin sinks to ground and monitors the current flowing into the LED2, intended to be used in illu-
mination application (Note 2). The Anode of the associated LED shall be connected to the Vout pin.
This pin sinks to ground and monitors the current flowing into the LED1, intended to be used in illu-
mination application (Note 2).
This pin copies the Analog Ground and must be connected to the system ground plane.
This pin carries the data provided by the I 2 C protocol. The content of the SDA byte is used to program
the mode of operation and to set up the output current (Note 1).
This pin provides the reference current, based on the internal band ? gap voltage reference, to control
the output current flowing in the LED. A 1% tolerance, or better, resistor shall be used to get the
highest accuracy of the LED biases. An external current mirror can be used to bias this pin to dynam-
ically set up the I ? LED peak current.
In no case shall the voltage at I REF pin be forced either higher or lower than the 600 mV provided by
the internal reference.
9
10
SCL
VOUT
INPUT,
DIGITAL
OUTPUT,
POWER
This pin carries the I 2 C clock to control the Charge Pump converter and to set up the output current.
The SCL clock is associated with the SDA signal.
This pin provides the output voltage supplied by the Charge Pump converter. The Vout pin must be
bypassed by 1 m F ceramic capacitor located as close as possible to the V OUT pin to properly bypass
the output voltage to ground. The circuit shall not operate without such bypass capacitor connected
across the Vout pin and Ground (Note 1).
The output voltage is internally clamped to 5.5 V maximum in the event of a no load situation. On the
other hand, the output current is limited to 40 mA (typical) in the event of a short circuit to ground.
11
12
?
VBAT
C1N
EXPAD
INPUT,
POWER
POWER
GROUND
This pin is the input Battery voltage to supply the analog and digital blocks. The pin must be de-
coupled to ground by a 1 m F or higher ceramic capacitor (Note 1).
One side of the external charge pump capacitor (C FLY ) is connected to this pin, associated with C1P,
pin 1 (Note 1)
EXPAD is not physically connected to the die. To optimize power dissipation, EXPAD must be connec-
ted to the system (PCB) power ground plane.
1. Using low ESR ceramic capacitor, X5R type, is mandatory to optimize the Charge Pump efficiency and to reduce the EMI.
2. The peak current is 37 mA for each LED, the total charge pump output DC current being limited to 75 mA.
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